High-frequency PCB design requires special considerations to ensure optimal performance of the board. These include rules that consider material selection, stackup, routing, and impedance control. By following these guidelines and taking the necessary steps, designers can create a high-frequency board that produces reliable results.
PCB is also known as printed circuit board, which can realize the line connection and function realization between electronic components, and is also an important part of power circuit design. Today, we will introduce the high-frequency PCB circuit wiring skills in PCB design.
With the continuous development of science and technology, the functional requirements of electronic devices are also constantly increasing. In order to meet this demand, HDI (High Density Interconnect) circuit boards came into being. HDI circuit boards have attracted much attention for their high density, high performance and high reliability, and have become an important bridge connecting future technologies.
In today’s fast-developing electronic age, PCB printed circuit boards are the heart of electronic products, and their design and manufacturing technologies are constantly improving, especially in the field of high-frequency circuits. High-frequency circuit design is not only related to the performance stability of the product, but also directly affects signal integrity and electromagnetic compatibility (EMC).
With the increase in signal transmission speed and the widespread application of high-frequency circuits, circuit board impedance control has become a key factor in ensuring signal integrity, reducing signal interference, and improving system stability
RO4000 series laminates can be processed using standard FR-4 techniques without specialized via preparation. They are rigid, thermoset laminates, compatible with automated systems and scrubbing equipment for copper surface preparation. RO4835 laminates are RoHS compliant and suitable for UL 94V-0 certified applications.
RO4000 hydrocarbon ceramic laminates are designed to offer superior high frequency PCB performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes offered at competitive prices.
This study was conducted to evaluate dimensional movement of Rogers RO4350B
Product through the circuit fabrication process. The study was conducted using Six
Sigma tools and the DMAIC process as a guideline for the evaluation (Define, Measure,
Analyze, Improve, and Control). The Six Sigma project was initiated as a joint exercise between Rogers Corporation and printed circuit board manufacturer Cirtech Inc.
Frequently, designers are concerned about temperature rise of the conductor traces on devices built in microstrip or stripline configurations on RT/duroid® microwave material. The question arises when there are high bias line currents, but the bias line needs to be as narrow as possible to keep its characteristic impedance high. It also is of concern when RF power levels are high.
Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design.