RO4000® hydrocarbon ceramic laminates are designed to off er superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes off ered at competitive prices. The selection of laminates typically available to designers is signifi cantly reduced once operational frequencies increase […]
Compared to traditional fiberglass boards, ceramic substrates offer superior mechanical strength, high-temperature resistance, and excellent thermal conductivity. In addition, ceramic substrates also exhibit excellent dimensional and chemical stability.
Ceramic PCBs (Ceramic Printed Circuit Boards) are circuit boards that use ceramic materials as substrates, offering excellent thermal management, electrical performance, and mechanical properties. Based on different application requirements and characteristics, ceramic PCBs come in various types, which are outlined below:
LTCC (Low Temperature Co-fired Ceramic) is a special type of ceramic material that integrates multiple ceramic layers together through a co-firing process. With its unique performance advantages, LTCC has found widespread application in circuits and systems operating at microwave, millimeter-wave, and higher frequencies.
In this context, ROGERS has introduced the RO4830™ material, which, with its excellent performance and lower cost, has become a key solution in driving the widespread adoption of 77 GHz millimeter-wave radar technology.
Solution Refinement and Layout: As the demand for smaller and more portable electronic devices continues to grow, the design of RF and microwave circuits is shifting towards more compact and efficient solutions. In high-frequency circuit design, the choice of PCB materials is crucial for determining circuit size, performance, and signal propagation characteristics. RT/duroid® 6010.2LM, a […]
In the PCB industry, the common types of copper foil are Rolled Annealed Copper (RA) and Electrodeposited Copper (ED).
By following these guidelines—such as optimizing trace width, minimizing via use, and ensuring proper documentation for manufacturing—you can significantly improve the performance, reliability, and manufacturability of your PCB designs.
Following these practical tips for high-frequency PCB design helps in optimizing interconnections within the board. Techniques such as using 45° transmission lines, precision etching, and non-leaded components will significantly enhance circuit performance. Familiarizing yourself with these methods makes designs like back-copper coplanar microstrip layouts both economical and efficient.
Open circuits in PCBs can often be traced back to mechanical damage during various stages of production—whether from scratched copper clad laminate, improper handling, or worn tools. Implementing the outlined improvement methods can significantly reduce the occurrence of these issues, improving both product quality and production efficiency.
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