PCB boards are made of a variety of materials that can be used for high-frequency and high-speed applications: hydrocarbon resins, PTFE, LCP (liquid crystal polymer), PPE/PPO etc.
China, as the world’s largest automotive market, has positioned itself as a formidable force in the field of autonomous driving technology. With over 160 OEM manufacturers and a rapidly growing electric vehicle (EV) sector, the nation’s drive toward intelligent mobility is accelerating. This blog explores the current state of autonomous driving technology in China, highlighting key players, technological advancements, and the unique strengths that position China as a global leader in this field.
FPC flexible PCB boards can produce four-layer PCB boards, but compared to double-layer or multi-layer FPC flexible PCB boards, the manufacturing process is more complex and issues such as insulation performance, signal transmission, manufacturing processes and applications need to be considered.
A via is a small hole on a PCB that connects different layers electrically. Structurally, a via consists of a drill hole and a pad.
Single-sided and double-sided PCBs serve different purposes based on complexity and application needs. Single-sided PCBs are cost-effective and ideal for simpler designs, while double-sided PCBs provide flexibility and higher circuit density for advanced devices.
When selecting the right substrate for your printed circuit board (PCB), understanding the key differences between aluminum PCBs and FR4 PCBs is crucial.
Printed Circuit Boards may be used in various ways in the automobile industry, and the sky is the limit. The use of Automotive PCBs connections to power autonomous, self-driving cars has generated a lot of interest in the industry because of the potential savings in transportation costs and the increased speed and safety of product delivery.
Both the military and aerospace industries require highly advanced electronics. Aerospace and military electronics require excellent reliability, quality, and compliance standards.
Ceramic substrates play a critical role in modern electronics, offering exceptional thermal performance, mechanical strength, and customization options. Alumina remains the most widely used material due to its affordability and versatility, while aluminum nitride is favored for applications requiring higher thermal conductivity. The choice of manufacturing process—whether HTCC, LTCC, DBC, DPC, or LAM—will depend on the specific needs of the application, including power electronics, electronic packaging, hybrid microelectronics, and multi-chip modules. With their outstanding thermal conductivity, mechanical stability, and electrical insulation properties, ceramic substrates play a pivotal role in developing advanced electronic devices.
The Internet of Things (IoT) refers to a network of physical devices, vehicles, appliances, and other physical objects embedded with sensors, software, and network connectivity that allow them to collect and share data