In the present world, especially in the current technological era, devices are becoming more compact and advanced. For implementing the compact and at the same time advanced electronic technology in the world, HDI PCBs contribute abundantly
Back drilling is a method to remove the via stub from the specific layer of multilayer PCB. Via stub is a non-functional portion of a plated through hole or via barrel which can cause unwanted reflection leading to signal distortion and lower performance. It is recommended that the diameter of the back drill hole be greater than that of the via hole size.
The manufacturing of HDI PCBs began in the late 1980s. With the successive production of PCBs, the first HDI production began in 1984. Since then, designers and manufacturers have been looking for ways to pack more components in a smaller area. HDI boards are designed and manufactured to comply with IPC-2315 and IPC-2226 standards.
A semi-flexible PCB is a type of printed circuit board made from rigid laminate materials (usually FR4) with sections thinned to 0.3 mm or less to allow bending. These PCBs combine the solid structure of rigid PCBs with the flexibility of modern flexible PCBs, achieving a balance that caters to compact designs.
Copper Core PCBs (CCPCBs) fall under the category of Metal Core PCBs, which use metal as a substrate, hence also known as Copper-Based PCBs. Similarly, Copper Core PCBs also use copper as a substrate, mainly because of the thermal conductivity properties of the material while maintaining the durability of the board itself
BGA is a surface mount component that is used for chip design ICs. The full name of BGA is ball grid array. Therefore, it has many balls in the form of an array. Generally, BGA is used for chip design PCBs such as microprocessors and integrated ICs
In conclusion, managing EMI and ensuring EMC are critical aspects of PCB design and manufacturing. By carefully considering factors like trace routing, grounding, component selection, and shielding, designers can minimize the risks associated with electromagnetic interference and create devices that perform reliably and safely.
As IoT technology advances, so do the requirements for Printed Circuit Board (PCB) design and manufacturing. This blog extends the discussion on how IoT is driving innovations in PCB design, exploring deeper insights into new design techniques, material advancements, manufacturing challenges, and future prospects.
BGA assembly refers to the process of attaching a ball grid array (BGA) to a circuit board using a solder reflow process. BGAs are surface mount components that use an array of solder balls to create electrical interconnections between components and PCBs
The Internet of Things (IoT) is revolutionizing industries worldwide, and its influence on Printed Circuit Board (PCB) design and manufacturing is profound. As IoT devices become more compact, efficient, and interconnected, the demand for innovative PCB designs has surged. This blog delves into how IoT is transforming PCB design and manufacturing, the challenges it poses, and the opportunities it presents.