As sintering tool materials – high-purity alumina substrates with excellent surface flatness help improve the characteristics, quality and yield of sintered products. They are also ideal for sintering highly reactive materials. A variety of porosity levels are available due to the ability to control porosity during substrate sintering.
Shenzhen KKPCB Technology Co., Ltd. is a company that specializes in the design, manufacture, and assembly of various printed circuit boards (PCBs), including ceramic substrates.
NIKKO LTCC substrates with silver conductor material provide multilayer substrates with low dielectric loss. Coils, capacitors and resistors can be embedded in the inner layer. Ideal for high-frequency modules and silicon wafer interposer substrates
The thermal expansion coefficient of these LTCC substrates is adjusted for use as wafer-level packaging substrates. The substrate surface has bumps for electrical connections, and CSP (chip-scale package) can be easily assembled by directly bonding to silicon wafers. Ideal for MEMS and semiconductor ceramic packages with a small number of leads.
Low dielectric loss characteristics (tan δ) and low resistance conductors, low electrical loss, suitable for high-frequency applications
Due to our unique manufacturing technology, the size and characteristics of each production batch and within each batch vary little
High-density wiring is achieved by improving stacking alignment accuracy
Precise control of substrate thickness and cavity shape
Resistance, inductance, and capacitance functions are built into the substrate and package
LTCC (Low Temperature Co-fired Ceramic) is a special type of ceramic material that integrates multiple ceramic layers together through a co-firing process. With its unique performance advantages, LTCC has found widespread application in circuits and systems operating at microwave, millimeter-wave, and higher frequencies.
KKPCB provides global customers with one-stop services from PCB layout, prototype PCB proofing, PCB manufacturing, PCBA processing (including SMT and DIP), PCBA testing, PCBA product assembly and outbound packaging. You could provide a Gerber file or BOM list to us, we will offer the finished PCB products or PCB assembly which are satisfied with you
With the rapid development of high-speed circuit design, PCB routing has evolved beyond simple interconnection tasks. Engineers must analyze various distributed parameters using transmission line theory. Distributed parameter circuits account for spatial variations in voltage and current. Modern PCBs, with their complexity and density, include advanced features like microvias, buried/blind vias, and embedded components (e.g., resistors, capacitors). These advancements require PCB designers to understand production processes deeply and adapt their designs to manufacturing constraints.
PCB design requires understanding physical processes and careful organization of layers, power networks, and signal paths. Following these recommendations reduces noise risk, improves reliability, and simplifies the routing of complex systems
When designing high-speed PCBs, the layer stack-up plays a crucial role in ensuring signal integrity, minimizing crosstalk, and achieving optimal electromagnetic compatibility (EMC). For a standard six-layer board with a thickness of 1.6mm, selecting the right structure can significantly impact performance. Below is an analysis of common six-layer board structures and their suitability for high-speed designs