| Number of layers |
1-40 layers |
Board thickness |
0.2mm-8.0mm |
| Board material type |
FR-4 Material, High Frequency Material, High Speed Material, Metal Backed Material |
Board Thickness (Tolerance) |
Standard tolerance: ±0.1mm (Thickness ≤1.0mm), ±10% (Thickness >1.0mm) |
| Layers |
(Rogers, PTFE) + FR4 |
Thickness of outer layer copper |
0.33oz-14oz |
| Brand of material |
ITEQ, Shengyi, TUC, Nan Ya, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, etc. |
Thickness of copper of inner layer |
0.5oz-12oz |
| Laser hole diameter |
0.075mm-0.15mm |
Minimum hole diameter |
0.1mm |
| Back drilling hole diameter |
0.2mm |
Back drilling clearance |
0.05mm-0.25mm |
| Minimum hole diameter for resin filling |
0.15mm |
Number of laser passes |
1-5 passes (consideration for ≥6 passes) |
| Line width/distance (minimum) |
2/2mil |
Impedance accuracy |
Standard tolerance: ±10% (<50Ω), ±10% (≥50Ω) |
| Aspect Ratio (Through Hole) |
25:1 |
Aspect Ratio (Laser Drilling) |
1:1 |
| Maximum finished board size |
1500*620mm |
Minimum finished board size |
2.0mm*2.0mm |
| Minimum BGA pitch |
0.35mm |
Contour tolerance |
±0.1mm |
| Solder mask color |
Green, Matte Green, Black, Matte Black, Yellow, Red, Blue, White |
| Surface coating |
Immersion Gold, Hard Gold Plated, Contact Gold Plated, Lead Free HASL, HASL, OSP, Electroless Nickel/Immersion Gold, Soft Gold Plated (with/without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+Electroplated Ferrite, Full Gold Plated+Electroplated Ferrite, Silver Plated+Electroplated Ferrite, Tin Plated+Electroplated Ferrite |
