Frequently, designers are concerned about temperature rise of the conductor traces on devices built in microstrip or stripline configurations on RT/duroid® microwave material. The question arises when there are high bias line currents, but the bias line needs to be as narrow as possible to keep its characteristic impedance high. It also is of concern when RF power levels are high.
Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design.
These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4003C™, RO4350B™ and RO4835™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.
RO3003, RO3003G2, RO3006 and RO3010 copper clad laminates are filled PTFE composites offering excellent thermal reliability and electrical performance over a range of dielectric constants. RO3000 series materials provide the homogeneity of properties that are expected of unreinforced materials.
Copper foils, for the wide range of Rogers’ high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.
OrCAD PCB Designer has the functionality to configure a 6-layer board, or any other type of PCB layer stackup to fit your exact needs
Circuit materials are exposed to high temperatures for short periods of time during processing and for longer periods of time during use. The effects of long-term high temperatures are often seen as oxidation accumulation on PCB thermoset dielectric materials, which can cause a shift in the Dk of the circuit material. Determining how sensitive a circuit material is to the effects of long-term aging requires precise and careful testing, as different measurement methods and techniques can yield very different measurement results when characterizing high-frequency circuit materials. Selecting the right test method, whether it is material-based or circuit-based testing, provides reliable data when modeling Dk and circuits.
The electronics industry has undergone many changes over the past few years. Nowadays, millimeter wave radar and millimeter wave communication frequently appear in our sight. In particular, Huawei has made remarkable achievements in 5G, and millimeter wave technology has been put on the table. Why does millimeter wave technology play such a key role in 5G and smart cars? Next, let’s take a closer look at the past and present of millimeter wave technology and its continuation.
Difficulties in high frequency board processing
1. Copper deposition: It is not easy to copperize the hole wall
2. Control of line gaps and sand holes in pattern transfer, etching, line width
3. Green oil process: control of green oil adhesion and green oil bubbling
4. Strict control of board scratches in each process, etc.
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