Client: Anonymous
Industry: Fiber Optic Test & Measurement, High-Speed Data Transmission
Application: Next-gen 100G/400G+ optical transceivers, OTDR equipment, and 50GHz RF test modules.
FIS designs precision fiber optic tools, requiring ultra-low-loss PCBs to maintain signal integrity at millimeter-wave frequencies (up to 50GHz). Their challenges include:
Insertion loss degrading high-speed signals (>40Gbps).
Impedance mismatches causing reflection noise.
Thermal expansion leading to microvia cracking in compact designs.
Optimizing Small Wind Turbine Inverters: Enhancing Stability & Reliability Customer Background & Market Demand Germany is a global leader in renewable energy, with its Energiewende (energy transition) policy driving widespread adoption of distributed wind power for rural electrification, industrial parks, and off-grid energy solutions. Small Wind Turbines (SWTs) have become an essential power supply option […]
When designing a PCB, one of the critical decisions you’ll face is whether to use plated or unplated mounting holes. These holes are essential for securing the PCB to an enclosure or package, but the choice between plated and unplated holes depends on your design requirements, grounding needs, and mechanical considerations. Let’s explore the differences, advantages, and best practices for each type.
With the increasing global water scarcity, especially in large-scale agricultural planting areas, traditional irrigation methods face issues such as water waste, cumbersome manual operations, and imprecise irrigation control. To address these pain points, we have helped our customers develop a wireless smart irrigation controller PCBA.
These PCB tolerances ensure that PCB circuit boards are produced precisely and can function as intended. Manufacturers adhere to specific in-house tolerance guidelines, based on international standards like IPC-A-600 Class 2, to maintain quality throughout the production process.
Electronics are becoming faster, smaller, and used in more demanding environments. Miniaturized ICs and SMDs operate at higher frequencies and require more power. Increased current demands cause voltage drops across resistive elements, generating heat and leading to temperature rises and hotspots. Over half of electronic component failures now stem from heat-related stress.
Chip-Scale Package (CSP) is a type of integrated circuit packaging technology. The size of the package is up to 1.2 times the size of the actual die, with only a single-die and a direct surface mountable package. First originating in the 1990s, it was developed as a response to the demand for smaller and more efficient packages.
Take a look at any type of multiconductor serial bus that uses single ended traces. You’ll probably see some resistors sitting around the bus being connected to driver pins and power or ground. The use of these resistors is intentional with the purpose being to set the signal level and reflection control on the bus. The other reason is placement as a pull-up resistor, where a line in the bus is pulled up to the signal power supply level.
PCB edge plating is a specialized process that involves applying a metal coating to the exposed copper connections at the edge of a printed circuit board (PCB). This technique, also known as side plating, battlement, or metallized edge plating, enhances electrical connectivity, structural rigidity, and electromagnetic interference (EMI) shielding.
A ball grid array (BGA) is a type of surface-mount packaging that features an array of small solder balls on the underside, which serve as electrical connections to the printed circuit board (PCB). Unlike dual in-line or flat packages, ball grid arrays offer the advantage of accommodating a greater number of interconnection pins, made possible by utilizing the entire bottom surface of the device for connections instead of only relying on the perimeter