In high-speed and RF PCB designs, controlling trace impedance is critical, but the role of RF via transitions is often underestimated. Vias, which connect signals between layers, can introduce impedance mismatches, signal reflections, and losses, especially at high frequencies. Proper design and optimization of via transitions are essential to maintain signal integrity and ensure reliable performance in RF and high-speed digital applications
Military and aerospace PCBs must adhere to intensely high standards to ensure their safety and functionality in the extreme conditions they’re used in. For this reason, PCB design for military and aerospace applications requires incredibly stringent guidelines with built in redundancy, extra safety, and stringent tolerances, minimizing risk of failure
PCB layout planning is a critical phase in the design process, enabling engineers to save time and ensure a structured approach to package management, component placement, and routing.
According to Joule or Ohmic heating principles (represented as VI or I²R), any conductive material generates heat, leading to a gradual temperature rise in both the conductor and its surroundings. Managing copper current density is critical to ensure reliable PCB performance and prevent overheating. This article explores key considerations, design guidelines, and tools like OrCAD X to optimize copper current density in PCB designs.
As high-density interconnect (HDI) designs with larger layer counts become more prevalent, the use of microvias is increasing. In builds with 3+N+3 or larger configurations, sequential lamination now often relies on skipped vias, staggered microvias, and stacked microvias
From anti-collision radar systems used in autonomous vehicles to the fifth-generation (5G) high data rate New Radio (NR) networks, the application of millimeter-wave (mmWave) circuits is growing rapidly. Many applications are pushing the operating frequency bands to higher frequencies (such as >24GHz).
A Multilayer PCB (Printed Circuit Board) is a type of PCB with more than two conductive layers. Unlike a double-sided PCB, which has two copper layers (top and bottom), a multilayer PCB consists of three or more layers of copper, interconnected by copper-plated vias. The number of layers can range from 3 layers to 40 layers or more, depending on the design requirements
A Single-Sided PCB (also known as a Single-Layer PCB or One-Layer PCB) is the simplest and most cost-effective type of printed circuit board. As the name suggests, it has a single conductive layer (usually copper) on one side of the substrate, with the electronic components mounted on the opposite side.
Surface Mount Technology (SMT) is a widely used method for manufacturing PCBs, where Surface Mount Devices (SMD) are directly mounted onto the surface of the PCB. This technology allows for a more compact design and higher component density compared to traditional through-hole mounting.
PCB (Printed Circuit Board) substrate materials are the backbone of a PCB assembly, providing the necessary foundation for copper tracks and electronic components. The choice of PCB material plays a critical role in determining the performance, durability, and overall reliability of the PCB. These materials can be resin-based, fiberglass-based, epoxy-glass, metal-based, or flame-retardant, and they are selected based on the specific requirements of the PCB design and its application.