Rigid-Flex boards are a combination of rigid boards and flexible circuits that are permanently laminated together and interconnected through through-holes. Rigid-Flex boards are also written as Flex-Rigid. Rigid-Flex boards straddle the boundaries of traditional rigid boards and the unique properties of flexible circuits, using highly ductile ED or RA copper photolithography onto a flexible insulating film
High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads.
Multilayer Printed Circuit Boards (PCBs) or Multilayer Boards (MLBs) feature more than two copper layers, interconnected using copper-plated holes. These holes may include NC vias, laser microvias, through-holes, buried, or blind vias. The layers consist of copper foil, prepreg (PP), or adhesive materials and are pressed together under high temperature and pressure. This process removes air and cures the thermosetting adhesives, forming a cohesive multilayer PCB
Electronic devices have transformed modern life, and at the heart of these innovations lies a critical component: the Printed Circuit Board (PCB). From smartphones and laptops to industrial machinery and household appliances, PCBs are the backbone of electronics, enabling functionality, precision, and reliability. What Is a PCB? A Printed Circuit Board (PCB) is a thin […]
A multilayer PCB, or Printed Circuit Board, is an advanced type of circuitry that facilitates complex electronic functionalities within a compact framework.
The Curamik® product suite offers best-in-class metallized ceramic substrates for higher power efficiency. Composed of pure copper bonded or brazed to a ceramic substrate, our curamik® substrates are designed to carry higher currents, provide higher voltage isolation, and operate over a wide temperature range.
Compared to traditional fiberglass boards, ceramic substrates offer superior mechanical strength, high-temperature resistance, and excellent thermal conductivity. In addition, ceramic substrates also exhibit excellent dimensional and chemical stability.
Ceramic substrates are typically located within the copper/metal layers of a power module as part of the power electronics circuitry. They function similarly to a PCB, allowing them to optimally perform their intended purpose
Ceramic PCBs (Ceramic Printed Circuit Boards) are circuit boards that use ceramic materials as substrates, offering excellent thermal management, electrical performance, and mechanical properties. Based on different application requirements and characteristics, ceramic PCBs come in various types, which are outlined below:
KKPCB’s high-strength flexible Alumina-Zirconia substrates have a bending strength that is more than 1.5 times that of standard alumina substrates. The thinnest thickness can reach 150um, which can reduce thermal resistance in the thickness direction. The substrate has high density, fine structure, and excellent flatness.