| Item |
Description |
DataSheet |
| Sheng Yi |
Core/P.P |
SI643HU, SI10U, SI09U, SI07U, SI05U |
| Mitsubishi Gas Chemical |
Core/P.P |
HL832NXA, HL832NS, HL832NSR(LC) |
| DooSan |
Core/P.P |
DS-7409HGB(S)，DS-7409HGB(LE)，DS-7409HGB(X) |
| Panasonic |
Core/P.P |
R1515E/R1515H |
| Other Materials |
Core/P.P |
E679FGB,E770G(LH)，BT-NSF(LCA) |
| Layer |
Layer |
1-16Layer |
| Min pattern size |
um |
25 |
| Min pattern Space |
um |
25 |
| Min Pad |
um |
80 |
| Min BGA Center Space |
um |
250 |
| 2L Min Thickness |
um |
80 |
| 2L Min thickness/core/Pp Thickness |
um |
80/30 |
| 4L Min thickness/core/Pp Thickness |
um |
200/50/20 |
| 6L Min thickness/core/PP Thickness |
um |
240/50/20 |
| 8L Min thickness/core/PP Thickness |
um |
330/50/20 |
| Solder mask Color |
|
Green,Black |
| Solder resist |
|
EG23A, AUS308, AUS320, AUS410 |
| Surface treatment |
|
Soft Gold Plating, Hard Gold Plating, ENIG, OSP |
| Flatness |
um |
5max |
| Min hole size |
wn |
100 |
| Min Laser hole size |
um |
50 |
| Min thickness tolerance |
um |
30 |
| Min PP |
um |
25 |
| Min Core |
um |
40 |
| Minimum Finger Center Distance |
um |
65 |
| Min para-position accuracy |
um |
15 |
| Support Process |
|
Subtraction process, mSAP Process |
| Soldermask tolerance |
um |
5 |
