1. Customer Requirements & Background

Industry: Defense Electronics
End Applications:

• Armored vehicle main control units
• Field communication relay equipment

Manufacturing Challenges:

• Heterogeneous material processing (AlSiC metal substrate + FR4 multilayer hybrid lamination)
• Extreme environment reliability (MIL-STD-810H vibration compliance)
• Military-grade quality control (100% inspection + batch traceability)

Previous Supplier Pain Points:
✔ AlSiC substrate yield only 65% (delamination due to CTE mismatch)
✔ PCIe gold finger contact failure rate 3,000 PPM (post-vibration)
✔ EMP shielding layer vacuum lamination yield below 80%

2. Core Manufacturing Capabilities

(A) Special Material Processing Techniques

Process Challenge	KKPCB Solution	Key Parameters
AlSiC-FR4 hybrid lamination	Stepwise thermoforming	85±3t pressure, 2°C/min ramp rate
Triple-redundant PCIe assembly	6-axis robotic alignment	Coplanarity <0.05mm, Z-axis ±5μm
Graded shielding vacuum lamination	Multi-stage vacuum degassing	Residual pressure <5Pa, parallelism ±0.3°

(B) Dedicated Production System

Military-Spec Line Configuration:

• Temperature/humidity controlled workshop (23±1°C, 45% RH)
• Full-process ESD protection (human body voltage <50V)

Process Controls:

• Real-time SPC (CPK ≥1.67 for critical parameters)
• Laser QR code traceability (individual board production logs)

3. Mass Production Efficiency Gains

(A) Process Optimization Results

Metric	Industry Avg.	KKPCB Result	Improvement
AlSiC substrate yield	65%	98.7%	+52%
PCIe connector failure rate	3,000 PPM	87 PPM	-97%
Daily output	40 panels/line	120 panels/line	200%↑
Rush-order lead time	14 days	72 hours	80%↓

(B) Quality Validation Data

• 3 consecutive zero-defect batches (Lot size: 500pcs)
• 1,500-hour vibration aging test – zero functional degradation

4. Manufacturing Technology Barriers

✔ Heterogeneous Material Bonding Technology:

• Proprietary AlSiC micro-etching (Ra=0.8-1.2μm)
• Interlayer adhesion >1.8N/mm (30% above MIL standard)

✔ Military-Grade Precision Assembly:

• Dedicated connector jigs (±3μm repeatability)
• X-ray + BGA red-dye dual inspection

✔ Extreme Environment Simulation:

• In-house vibration chamber (5-2000Hz, 50G acceleration)
• Climatic-composite test chambers (combined temp/humidity/vibration)

5. Production Showcase

(A) Military Production Line Layout (Photo Recommended)

[Pre-treatment] → [Auto Hybrid Lamination] → [Precision Assembly]
　　　　　↓　　　　　↓　　　　　↓
[Vacuum Lamination] → [Mil-Spec Cleaning] → [Conformal Coating]
Note: Independent material flow, showcase automated equipment clusters.

(B) Process Comparison (SEM Microscopy Recommended)

• Industry Standard: Micro-cracks at AlSiC interface (500×)
• KKPCB Process: Void-free bonding (500×)

(C) Traceability System UI (Screenshot Suggested)

QR scan reveals: Lamination curves / Test reports / Operator IDs

6. Customer Value

✔ Cost Reduction: 39% lower unit cost (via material utilization)
✔ Delivery Assurance: 500-panel safety stock for military orders
✔ Quality Commitment: 36-month extended warranty

7. Certifications & Services

◼ Compliance:

• MIL-PRF-31032 certified line (Cert#: KK-MIL-2287)
• IATF 16949 automotive-grade QC adaptation

◼ Value-Added Services:

• ITAR-compliant covert packaging
• 24/7 engineering support

Client Testimonial:
“KKPCB achieved 99.3% first-pass yield in initial mass production—far exceeding our expectations.”
— SQE Manager, Defense Contractor

Contact info: [email protected]