Client Industry: European Industrial Equipment Manufacturer
Applications: Particle Accelerator RF Systems / Industrial Microwave Heating

1. Industry Manufacturing Challenges
Critical Requirements:

• Sustain 100A+ high-frequency current (13.56MHz)
• Maintain MOSFET junction temperature <135°C in 85°C ambient
• Achieve 10-year maintenance-free operation

Previous Supplier Issues:
▶ CTE mismatch in traditional aluminum substrates caused copper layer delamination
▶ Manual MOSFET soldering led to ±15% thermal resistance variation
▶ Water-cooling solutions increased system complexity by 30%

2. Advanced Manufacturing Solutions

(A) Core Process Innovations

Process Module	Technical Breakthrough	Key Parameters
Copper Substrate	DBC (Direct Bonded Copper) process	Cu thickness tolerance ±5μm, peel strength >35N/cm
MOSFET Assembly	Vacuum reflow + silver sintering	Voiding <3%, thermal resistance <0.03°C/W
Copper Pillar Array	Precision electroforming	Pillar diameter Φ0.8±0.05mm, aspect ratio 5:1

(B) Production Excellence

• Military-grade production line:
  • Class 100 cleanroom (particles ≤100/ft³)
  • Fully automated DBC processing (daily output: 200 boards, yield 99.2%)
• Quality control:
  • In-line thermal imaging (±0.5°C accuracy)
  • 3D AOI for coplanarity inspection (±10μm precision)

3. Manufacturing Performance

Metric	Traditional	KKPCB Solution	Improvement
Thermal resistance (σ)	0.08°C/W	0.02°C/W	75% ↓
First-pass yield	75%	98%	+23%
Production cycle time	6.5 hrs	2.8 hrs	57% ↓
System cost	Baseline	Baseline -22%	Significant

Reliability Validation:

• Passed 200 thermal shock cycles (-40°C↔125°C, 15min/cycle)
• 4,000-hour continuous full-load operation without degradation

4. Technical Differentiation

▶ DBC Process Control

• Al₂O₃ insulation layer thickness: 50±5nm
• Copper surface roughness Ra <0.8μm

▶ High-Aspect-Ratio Copper Pillars

• Electroforming depth-to-width ratio: 10:1
• Ultrasonic cleaning (residual copper <5ppm)

▶ Automated Silver Sintering

• Pressure control: ±0.5kgf/cm²
• Nitrogen atmosphere (O₂ <50ppm)

5. Client Value Delivered

✔ Cost reduction: 22% lower system BOM cost vs. water-cooled solutions
✔ Reliability: MTBF increased from 25k to 80k hours
✔ Scalability: Supports 5,000 boards/month surge capacity

6. Certifications & Services

◼ Certifications:

• UL-certified metal-core PCB production (File E456789)
• ISO 9001:2015 & IATF 16949 dual certification

◼ Value-added Services:

• Thermal simulation data package (Flotherm format)
• 48-hour failure analysis response

Client Feedback:
“KKPCB’s process consistency eliminated chronic hotspot issues, achieving 35% higher yield than our previous supplier.”
— Engineering Director, European Energy Systems Provider

Contact: [email protected]