PCB Assembly Capabilities

SMT assembly capacity: 19 million points/day
Testing Equipment	X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed	Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications	Pasteable smallest package
	Minimum device accuracy
	IC type chip accuracy
Mounted PCB Specifications	Substrate size
	Substrate thickness
throw rate	1. Resistance-capacitance ratio 0.3%
	2. IC type without throwing material
Board Type	POP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity
DIP plug-in production line	50000 points/day
DIP post welding production line	20000 points/day
DIP test production line	50000pcs PCBA/day

PCB Assembly processing capability

The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability
project	Mass processing capability	Small batch processing capability
Number of layers (max)	2-28	20-30
Plate type	FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet	PTFE, PPO, PPE
	Rogers,etc Teflon	E-65, ect
Sheet mixing	4 layers – 6 layers	6th floor – 8th floor
biggest size	610mm X 1100mm	/
Dimensional Accuracy	±0.13mm	±0.10mm
Plate thickness range	0.2mm–6.00mm	0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm)	±8%	±5%
Thickness tolerance (t＜0.8mm)	±10%	±8%
Media thickness	0.076mm–6.00mm	0.076mm–0.100mm
Minimum line width	0.10mm	0.075mm
Minimum spacing	0.10mm	0.075mm
Outer copper thickness	8.75um–175um	8.75um–280um
Inner layer copper thickness	17.5um–175um	0.15mm–0.25mm
Drilling hole diameter (mechanical drill)	0.25mm–6.00mm	0.15mm–0.25mm
Hole diameter (mechanical drill)	0.20mm–6.00mm	0.10mm–0.20mm
Hole Tolerance (Mechanical Drill)	0.05mm	/
Hole tolerance (mechanical drill)	0.075mm	0.050mm
Laser Drilling Aperture	0.10mm	0.075mm
Plate thickness aperture ratio	10：1	12：1
Solder mask type	Photosensitive green, yellow, black, purple, blue, ink	/
Minimum Solder Mask Bridge Width	0.10mm	0.075mm
Minimum Solder Mask Isolation Ring	0.05mm	0.025mm
Plug hole diameter	0.25mm–0.60mm	0.60mm-0.80mm
Impedance tolerance	±10%	±5%
Surface treatment type	Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board	Immersion Tin, OSP

SMT main equipment process capability
machine	scope	Process parameters
Printing press  GKG GLS	PCB printing seal	50X50MM~610x510mm
	Printing accuracy	±0.018mm
	Frame size	420×520mm—737×737mm
	PCB  thickness range	0.4-6mm
All-in-one machine for stacking board	PCB conveying seal	50X50MM~400x360mm
Unwinding machine	PCB conveying seal	50X50MM~400x360mm
YAMAHA YSM20R	When transferring 1 board	L50×W50mm ～L810×W490mm
	SMD theoretical speed	95,000CPH ( 0.027sec / CHIP )
	Mounting range	0201(mm)-45*45mm component mounting height: less than 15mm
	Mounting accuracy	CHIP±0.035mm  ( ±0.025mm )  Cpk ≧ 1.0  ( 3σ )
	number of components	140 kinds ( 8mm reel)
YAMAHA YS24	When transferring 1 board	L50×W50mm ～L700×W460mm
	SMD theoretical speed	72,000CPH ( 0.05sec / CHIP )
	Mounting range	0201(mm)-32*mm component mounting height: 6.5MM
	Mounting accuracy	±0.05mm(μ+3σ) 、±0.03mm(3σ)
	number of components	120 kinds ( 8mm reel)
YAMAHA YSM10	When transferring 1 board	L50×W50mm ～L510×W460mm
	SMD theoretical speed	46000CPH ( 0.078sec / CHIP )
	Mounting range	0201(mm)-45*mm component mounting height: 15MM
	Mounting accuracy	±0.035mm (±0.025mm) Cpk ≧ 1.0 (3σ)
	number of components	48 types ( 8mm reel) / 15 automatic IC trays
JT TEA–1000	Adjustable for each dual track	W50~270MM substrate / single track adjustable W50*W450mm
	The height of components on the PCB board	25MM up and down
	conveyor belt speed	300~2000MM/MIN
ALeader ALD7727D AOI Online	Resolution / Visual Range / Speed	Optional: 7µm/Pixel FOV: 28.62mm x 21.00mm     Standard: 15µm/Pixel FOV: 61.44mm x 45.00mm
	Detection speed	＜230ms/FOV
	barcode system	Automatic barcode recognition ( 1D or 2D code )
	PCB size range	50×50mm(Min) ～510×300mm(Max)
	1 track fixed	1 track is fixed, 2 , 3 , 4 tracks can be adjusted, the minimum size between 2 and 3 tracks is 95mm , and the maximum size of 1 , 4 tracks is 700mm ;
	single track	The maximum width of the track is 550mm ; for double tracks: the maximum width of both tracks is 300mm (testable width);
	PCB thickness range	0.2MM ~ 5mm
	PCB top and bottom clearance	Top Side of PCB : 30 mm Bottom Side of PCB : 60 mm
SPI  Stech	barcode system	Automatic barcode recognition ( 1D or 2D code )
	PCB size range	50×50mm(Min) ～630×590mm(Max)
	precision	1µm, Height : 0.37µm
	Repeatability	Less than 1µm (4sigma)     Volume / Area : Less than 1% (4sigma)   Height : Greater than 1µm (4sigma)
	FOV speed	0.3s/FOV
	Reference point detection time	0.5sec/pcs
	Maximum detection height	±550µm~1200µm
	Bending PCB Maximum Measurement Height	±3.5MM~±5MM
	Minimum pad pitch	100µm ( based on a pad with a pad height of 1500µm )
	Minimum measurement size	Rectangle 150µm, Round 200µm
	Component height on PCB	40MM up and down
	PCB board thickness	0.4~7MM
Shansi XRAY inspection equipment VX1800	Light tube voltage	130V-160KV
	light tube current	0.15mA
	System magnification	130 kV: 1500X 160 kV: 6000X
	Closed tube function	Closed tube optional 90KV and 130KV, high power penetration shielding layer effect is better, detection of samples below 1 micron
	Can detect samples at 70 degree angle	System magnification up to 6000
	Light pipe focus size	1um-3um
	Stage	650mmX540mm
	geometric magnification	300 times
	BGA detection	The magnification is larger, the image is clearer, and it is easier to see BGA virtual soldering and tin cracks
	Stage	X , Y , Z direction positioning can be carried out ; X- ray tube and X- ray detector direction positioning