RO4000® laminates with TICER® TCR thin film resistor foils combine the high-frequency performance of Rogers RO4000® laminates with the versatility of integrated thin film resistors. These materials are designed to simplify circuit fabrication, enhance performance, and reduce component count in RF and microwave applications.

Material Overview

Property	Value
Base Material	RO4003C™, RO4350B™, or RO4835™
Resistor Foil Type	TICER® TCR thin film foils
Resistivity Range	25–250 ohms/square
Dielectric Constant (Dk)	Dependent on laminate (e.g., 3.38 for RO4003C)
Dissipation Factor (Df)	Low, material-dependent

Key Features

1. Integrated Thin Film Resistors:
   • Eliminates the need for discrete resistors.
   • Reduces component count and simplifies circuit layout.
2. High-Frequency Performance:
   • Low loss and stable dielectric properties for RF/microwave designs.
   • Suitable for precision impedance matching and termination networks.
3. Compatibility with Standard Processing:
   • Can be processed using standard PCB manufacturing techniques.
   • Compatible with photolithographic resistor definition.

Applications

• High-frequency power dividers and couplers
• Attenuators and termination circuits
• RF filters and matching networks
• Microwave and millimeter-wave integrated circuits (MMICs)

Processing Guidelines

1. Resistor Definition

• Resistors are typically defined using photolithography:
  1. Apply photoresist and expose the desired pattern.
  2. Develop and etch the resistor foil to achieve the required geometry.

2. Resistor Trimming

• Fine-tune resistor values using laser or mechanical trimming.
• Verify resistance after trimming to ensure accuracy.

3. Laminate Handling

• Avoid scratches or contamination on the thin film resistor foils.
• Store materials in a controlled environment to prevent oxidation or damage.

4. Etching and Plating

• Protect resistor areas during etching and plating processes.
• Use compatible chemistries to avoid damaging the resistor layer.

5. Solder Mask Application

• Ensure proper alignment to protect resistor patterns during soldering and assembly.

Performance Considerations

1. Temperature Stability:
   • TICER® TCR foils offer excellent temperature coefficient of resistance (TCR) performance, ensuring stability across a wide range of operating conditions.
2. Power Handling:
   • Ensure adequate thermal management for resistors carrying high currents or dissipating significant power.
3. Dielectric Properties:
   • The performance of the resistors depends on the underlying laminate’s dielectric constant and loss tangent.

Benefits

• Reduced Assembly Time: Integrated resistors eliminate placement and soldering steps.
• Enhanced Reliability: Fewer solder joints result in improved circuit robustness.
• Compact Designs: Enables smaller form factors for RF/microwave circuits.