IT180ATC (ITEQ IT-180ATC) is a high-Tg, low-CTE epoxy laminate intended for multilayer PCB designs that face lead-free assembly heat. Its companion IT-180ABS is the prepreg designation in ITEQ’s published specification. If your search is for IT180ATC data, this guide highlights the verified thermal values, explains what they mean for vias and stackups, and lists the information a board fabricator needs for a reliable quote.

IT180ATC material properties from the ITEQ specification

ITEQ identifies IT180ATC laminate as a phenolic-cured multifunctional epoxy with a glass transition temperature greater than 170°C. The manufacturer’s specification sheet lists decomposition temperature above 340°C at 5% weight loss. It gives typical Z-axis CTE values of 45 ppm/°C below Tg and 240 ppm/°C above Tg, with 2.8% typical Z-axis expansion from 50°C to 260°C. The distinction between below-Tg and above-Tg behavior matters: a plated barrel and the surrounding laminate expand differently during assembly heating.

The same ITEQ sheet reports typical time-to-delamination results greater than 60 minutes at 260°C, 20 minutes at 288°C and 5 minutes at 300°C, with copper removed for testing. Those are laboratory test results, not permission to use an arbitrary reflow cycle. The sheet describes lead-free process compatibility, and its process guideline emphasizes dry laminate storage and controlled prepreg handling.

For electrical design, the document lists a 1 MHz permittivity specification below 5.4 and a parenthetical typical value of 4.8; the loss-tangent maximum at 1 MHz is below 0.035 with a parenthetical typical 0.016. Those values cannot be copied into a GHz insertion-loss model. Ask for frequency- and construction-specific dielectric data when the design has high-speed channels or RF traces.

Where does IT180ATC fit?

IT180ATC PCB material is a candidate for multilayer boards with repeated lead-free soldering, dense plated-through holes, or a need to control through-thickness expansion. It is especially relevant when thermal reliability is more important than simply choosing the lowest-cost FR-4 grade. The final decision still depends on finished board thickness, copper distribution, via geometry, assembly profile and product qualification.

For high-speed designs, treat the high-Tg rating and dielectric loss as separate questions. A high Tg does not establish low loss at 10 GHz. Compare loss budget, impedance targets, glass style and copper roughness against the actual fabricator stackup. KKPCB’s PCB materials and high-frequency PCB pages provide related design context.

Fabrication decisions to make before release

• Core and prepreg: state IT180ATC for the laminate and confirm whether IT-180ABS prepreg is required. List each dielectric layer, finished thickness and any permitted material substitute.
• Via reliability: provide board thickness, drill diameter, aspect ratio, via pitch and expected thermal cycling. Review the plated-hole design with the fabricator instead of relying on Tg alone.
• Copper and impedance: identify copper weight, layer order, reference planes, controlled-impedance targets and tolerances. Ask for a construction-specific impedance calculation.
• Thermal process: share peak reflow temperature, cycle count and any selective solder or rework steps. Confirm bake and moisture-handling requirements for the chosen stock.
• Acceptance: specify IPC class, impedance coupons, microsections and any customer-specific qualification tests.

The manufacturer’s process guideline includes handling details for prepreg and laminate as well as lamination and drilling considerations. These are starting points for a qualified shop’s process development, not universal press or drill recipes. For more on the interaction of layer count, resin and plating, review multilayer PCB manufacturing.

IT180ATC FAQ

Is IT180ATC the same as IT-180ABS?

No. The ITEQ document labels IT-180ATC as laminate and IT-180ABS as prepreg. A stackup must specify the roles and constructions of both materials.

Does high Tg guarantee reliable vias?

No. Tg and Z-axis CTE help evaluate thermal stress, but plated-hole life also depends on board geometry, copper plating, process control and the number and severity of thermal cycles.

Can I use the 1 MHz Dk value for high-frequency impedance?

No. Obtain a Dk value for the selected construction and the design frequency or an approved fabricator model before finalizing trace widths.

Request an IT180ATC stackup review

To obtain a meaningful RFQ, send Gerber or ODB++ data, layer stack, dielectric and copper targets, impedance table, finished drill chart, assembly profile and annual volume to KKPCB’s contact page. Ask for confirmation of IT180ATC availability, current manufacturer data sheet and any proposed alternative before approval.

Technical source: ITEQ IT-180ABS/IT-180ATC specification sheet and process guideline. Verify current revision and agreed material properties for production purchasing.